Monday, August 29, 2016
VOLUME -26 NUMBER 8
Publication Date: 08/1/2011
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ARCHIVE >  August 2011 Issue >  Electronic Mfg. Products > 

Lord Intros Low Cost Underfill
Underfill being applied.
Cary, NC — Lord Corporation has introduced ME-555, a new, low cost underfill encapsulant developed specifically for the semiconductor packaging and assembly industries.

Developed to meet technical requirements of its customers, the company has been able to present this material with a significant cost reduction compared to competitive underfill materials. Comparable with underfills such as Henkel 4526, the ME-555 offers excellent flow characteristics, thermal cycling reliability and low Coefficient of Thermal Expansion (CTE).

The new material is a high purity, semiconductor-grade epoxy underfill material for encapsulating flip chip devices. It is formulated to reduce warpage and with the necessary structural strength to handle over-molding processes.

Designed with optimum surface tension and viscosity to achieve full coverage without producing bulky fillet or creeping on top of the device, the underfill material will flow consistently without voids while maintaining a fast flow rate. It can be used under CSP/BGAs and small die with stand-off heights as small as 25µ. Because of its low CTE, ME-555 minimizes the possibility of cracking and greatly improves reliability during temperature cycling and temperature shock. In addition, it provides good adhesion to laminate, ceramic, solder mask and metal surfaces, as well as a high Tg and high fracture toughness, which provide strong mechanical protection for the entire device and prevents premature failures in the package.

Contact: Lord Corp., 111 Lord Dr., Cary, NC 27511 919-469-2500 Web:
http://www.lord.com

 
 
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