Friday, December 9, 2016
VOLUME -26 NUMBER 8
Publication Date: 08/1/2011
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Archive >  August 2011 Issue >  New Products > 

Microsemi Intros Replacement Solution for EOL Package
Irvine, CA — Microsemi Corporation has introduced a new multichip (MCP) memory product that provides a drop-in replacement for the discontinued Micron memory package used in Texas Instruments (TI) processors. The MS29C2G24MAKLA1-XI is the first in a family of planned products, and is available today.
 
The new memory solution is compatible with TI processor families that are enclosed in Micron Technology's end-of-life (EOL) package-on-package (PoP) 152-pin ball grid array (BGA). The Microsemi replacement package allows users to avoid time-consuming board redesign efforts and to protect current design wins.
 
The new Microsemi component family is compatible with TI's Sitara, OMAP, and DaVinci processors. The initial product has the same footprint as Micron's MT29C2G24MAKLACG-XIT, providing a replacement for the EOL package. Additional features include LPDDR and LPDDR+ flash and are specifically designed to support TI OMAP35xx, AM37x and DM37x processors.

The new component family extends the life of memory devices in the 152BGA package currently EOL, providing the same form, fit, and function. The product supports TI processors that employ the use of a PoP memory support chips.

In addition, the company's MS29C2G24MAKLA1-XI (OMAP MCP) memory houses 2G (x16) SLC NAND Flash and 1G (x32) Mobile LPDDR MCP combination memory with separate interfaces in a 14 x 14mm, 152 BGA (ball grid array) package with a 0.65mm pitch. It has 1.8V flash and 1.8V LPDDR with an industrial temperature range of -40 to +85°C and low voltage operation. The company plans to offer 4G-2G and 2G LPDDR versions later this year.

Contact: Microsemi Corporation, 2381 Morse Ave., Irvine, CA 92614 800-713-4113 or 949-221-7100 Web:
http://www.1microsemi.com

 
 
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