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Monday, June 27, 2016
VOLUME -23 NUMBER 12
Publication Date: 12/1/2008
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Electronic Mfg. Services
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Special Features: Test and Measurement
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August 2011 Issue
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Lead-Free Soldering Symposium Scheduled at SMTAI
Minneapolis, MN — The SMTA's renamed Lead-Free Soldering Technology Symposium will be held on October 20, 2011 as a focused symposium at SMTA International in Ft. Worth, TX. The scope of this year's symposium is the reliability of interconnections, particularly those studied in the second phase of the NASA-DoD Pb-Free Consortium project.
The project is providing unprecedented data on the long-term performance of Pb-free interconnections, addressing alternative surface finishes as well as the performance of mixed SnPb/Pb-free solder joints and the effects of rework activities. Session topics include an Overview and Update of the NASA-DoD Lead-Free Electronics Project, Investigating the Edges of Lead-Free Assembly Processes, Mechanical Reliability Performance of Lead-Free Solder Alloys, and the Impact of Alloy Composition, Design and Load Parameters in Lead-Free Solder Joint Reliability.
Papers will be presented by speakers from IBM, Celestica, Boeing, NASA, Rockwell Collins, Alcatel-Lucent and Amkor Technology among others. "Programmatic Challenges of Pb-Free Technology for the High-Reliability Electronics Industry" is the title of the keynote address given by Paul Vianco, Ph.D., Sandia National Laboratories and symposium chair and co-organizer.
Contact: SMTA, 5200 Willson Rd., Suite 215, Edina, MN 55424 952-920-7682 fax: 952-926-1819 Web:
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