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Sunday, May 27, 2018
VOLUME -26 NUMBER 9
Publication Date: 09/1/2011
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Assembly and Production
Product Preview: AATE and IPC-MW
September 2011 Issue
Front Page News
Solar Cells Empower Tribal Energy
Albuquerque, NM — Most Americans take electric power for granted, but for thousands of people living on tribal lands, getting to the grid can be a challenge. A lack of infrastructure, transmission capabilities and policies impede the availability of electricity within the reservations and to outlying ...
NIST Physicists Entangle Atoms with Microwaves
Boulder, CO — Physicists at the National Institute of Standards and Technology (NIST) have for the first time linked the quantum properties of two separated ions (electrically charged atoms) by manipulating them with microwaves instead of the usual laser beams, suggesting it may be possible to replace an exotic ...
PCB Production Up Sharply Worldwide
Bannockburn, IL — Worldwide production of printed circuit boards (PCBs) grew by 19 percent over 2009 to nearly $55 billion, according to the World PCB Production Report for the Year 2010, recently released by IPC — Association Connecting Electronics Industries
Indium Corporation to Feature AuSn Solder Preforms at International Microwave Symposium
CLINTON, NY -
will feature its precision AuSn solder preforms at
International Microwave Symposium
(IMS) 2018 from June 10-15 in Philadelphia, Penn.
Indium Corporation’s AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and sealing.
SEMICON WEST Adds WT | Wearable Technologies Conference Co-Location: Premier U.S. electronics manufacturing event expands with wearables program
MILPITAS, CA - SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that the WT | Wearable Technologies Conference 2018 USA will co-locate July 11-12 with SEMICON West 2018 in San Francisco.
Flex Power Modules announces new BGA packaging option for digital point-of-load DC/DC converters
Flex Power Modules today announced that its BMR466 and BMR461 digital point-of-load (POL) DC/DC power modules are now available to customers with BGA (Ball Grid Array) packaging, as well as in their original compact LGA (Land Grid Array) package.
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