Saturday, May 26, 2018
Publication Date: 09/1/2011
Archive >  September 2011 Issue >  Hi-Tech Events > 

OK International Delivers Award Winning Presentation at SMTA China
Shenzhen, China — OK International did a repeat performance of its award-winning presentation, "Rework Challenges for LGA/QFN Packages" at SMTA China South Conference, which happened August 29 to September 1 at the Shenzhen Convention & Exhibition Center to coincide with Nepcon China South. The production assembly specialist picked up the Best Presentation of Vendor Conference Three award for their rework presentation at SMTA China East Conference in Shanghai earlier this year. The presentation was very well received and judged to be an innovative presentation on the subject of rework challenges.

The paper was delivered by OK International's Advanced Product Applications Manager, Paul Wood and China Regional Sales Manager, Vincent Goh, on Tuesday, August 30th. In it, the authors look at how to optimize rework of increasingly ultra fine pitch components, which can now be as fine as 0.4mm pitch with pads as narrow as 1.2 to 2mm. Since aligning these packages with standard screen printing tools can be difficult due to large component body tolerances, the company has pioneered various technologies to manage the process.

The latest is a new jig tool, introduced in the presentation. The Jig technology has delivered significant improvements in the rework of components with large body variances or ultrafine pitch that goes below 0.5mm.

OK International was presented with the award in May 2011 during a ceremony held at the Shanghai Everbright International Hotel in conjunction with the SMTA China Fifth Anniversary Gala dinner.

Contact: OK International, 12151 Monarch St., Garden Grove, CA 92841 714-799-9910 fax: 714-799-9533 Web:

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