Tuesday, May 22, 2018
Publication Date: 09/1/2011
Archive >  September 2011 Issue >  Hi-Tech Events > 

SMTA International Tackles Head-in-Pillow Defects
Minneapolis, MN — SMTA International will provide updated research on Head-in-Pillow component soldering defects as well as a focused tutorial on the subject. SMTAI will take place October 16-20, 2011 at the Ft. WorthConvention Center in Ft. Worth, Texas.

Dudi Amir, Intel Corporation, will discuss Head-in-Pillow defects in depth in his tutorial on Monday, October 17. Dudi will instruct how to identify the root cause of the failure and give potential solutions to preventing the defect from happening and creating a robust SMT assembly process. Also discussed will be various failure analysis techniques to identify head-and-pillow non wet and several case studies.

Jasbir Bath, Owner, Bath Technical Consultancy, will chair a technical session focused on Solder Paste Development, Component Warpage Measurement and Case Studies and featuring presentations from Cookson Electronics, ZN Technologies, and Intel Corporation. Jasbir recently commented that, "Head-in-Pillow component soldering defects are still a concern in the industry with the session looking at developments in solder paste and component warpage measurement equipment as well as reviewing warpage information for components. There is still work to be done in updating component and board warpage standards and this session along with other information from the conference will give an update on where the industry is in reducing this defect and where it needs to go."

The presentation about board warpage by John Davignon, Intel Corporation and the INEMI SMT Co-Planarity Work Group, may also be of interest to attendees looking for background about HiP. The paper is titled "Industry Snapshot of PCB Dynamic Co-Planarity at Elevated Temperatures."

Also on the schedule are special sessions and a tutorial on Package-on-Package (PoP) surface mount stacking. Lee Smith, Amkor Technology, will chair a session titled "Assembly Solutions for Next Generation Package on Package (PoP) Requirements and Process" and "Reliability Characterization of PoP Materials and SMT Processes" which will feature presentations from Intel Corporation, Qualcomm, Rambus Inc.

Smith commented that, "Package-on-Package (PoP) surface mount stacking has seen widespread adoption over the last 5 years. Today nearly every smartphone and media tablet in the world specifies PoP for their signal processing and memory architecture, resulting in over 11 million packages surface mount stacked per week. SMTAI continues to be the conference where leading edge PoP technologies are discussed openly across the electronics supply chain." A second PoP-related session titled "Process and Reliability Characterization of PoP Materials and SMT Processes," chaired by Sheldon Schwandt of Research In Motion, will feature papers from Amkor Technology, Flextronics, and Universal Instruments Corporation.

Lee Smith will also deliver the Opening Session presentation, "Package on Package (PoP): Past, Present and Future" on Tuesday, October 18. The session is open to all attendees.

Charles Bauer, Ph.D., TechLead Corporation, will instruct a half-day course on "3D Assembly — CSP to PoP to Board." The tutorial covers both the fundamental and advanced technologies that today produce stacked chip packages and assemblies as well as stackable packages for implementation of highly integrated electronic products. These include the challenges of die thinning, thin die attach, multi-level wire bonding, mixed technology die attachment and bonding, flip chip, TAB and TSV technologies.

Alternate Alloys Sessions
There will be two sessions on Alternate Lead-Free Alloys. The Alternate Lead-Free Alloys sessions will analyze materials and processes as well as low cost solutions. Papers from Henkel, Nihon Superior Co., Indium Corporation, Senju Comtek Corporation, and Christopher Associates/Koki Solder will be presented.

Ron Lasky, Ph.D., P.E., Indium Corporation, who will chair one session, commented that, "Alternate lead-free alloys may become the mainstays for electronics assembly. Having less silver than the SAC305 default, these alloys have improved drop shock and acceptable thermal cycle performance for many applications. The low silver work has encouraged investigation into other lead-free systems. This leading edge work will be discussed at the Alternate Alloys Session."

Contact: SMTA, 5200 Willson Rd., Suite 215, Edina, MN 55424 952-920-7682 fax: 952-926-1819 Web:

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