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Publication Date: 09/1/2011
Archive >  September 2011 Issue >  Hi-Tech Events > 

IPC Midwest Tech Conference: Defect-Free, Reliable Electronics
Bannockburn, IL — For an industry that is constantly advancing, the technical conference at IPC Midwest Conference & Exhibition on September 21 & 22, in Schaumburg, Illinois, will present five sessions offering the latest research, methodologies and insights from industry experts to address critical challenges of manufacturing defect-free, quality electronics.

To help engineers meet increasingly stringent performance requirements, the session, "Test and Measurement Solutions," will spotlight research from Robisan Laboratory, Foresite, Agilent Technologies, Kyzen, IEC Electronics and Precision Analytical Laboratory that addresses issues from nanotechnology-based measurements for evaluating roughness of copper conductors on printed boards to evaluations of the combination of materials and processes for determining surface insulation resistance and electrochemical migration performance. In addition, Trace Laboratories will review a means to develop a counterfeit inspection procedure for incoming materials.

In "Minimizing Defects in Assembly Processing," experts from DfR Solutions, Research In Motion Ltd., and IPC will guide participants through critical issues that influence defect levels in assembly processing, including the utilization of design for reliability (DfR) concepts to eliminate common mistakes at the design level. Also, the latest work from the IPC Solder Products Value Council (SPVC) and a new industry standard addressing visual examination and cross-sectioning for the evaluation of underfills will be discussed.

Improving printed board functionality and minimizing space through the use of both embedded and bottom termination components have received increased industry focus, but each comes with its own set of implementation challenges. To address these challenges, presentations from Solberg Technical Consulting, Indium and Ray Prasad Consultancy will be featured in, "Bottom Termination and Embedded Component Challenges." In addition, the session will cover the difficulties of achieving good yields due to package and printed board planarity issues that bottom termination components pose (with their absence of solder balls), as well as voiding, resulting from the outgassing of solder paste flux in proximity to thermal pads.

In "Lead-Free Solder Alloys and Thermal Cycling Performance," experts from Indium, Rockwell Collins, Christopher Associates and Cobar Europe B.V. will address the minute changes in alloy content that can improve drop shock and thermal cycle reliability of low-silver alloys. Participants will also be privy to two revealing studies: an investigation of a solder joint integrity assessment of tin/bismuth component surface finishes in both tin-lead and lead-free soldering processes under thermal cycling conditions, and a ten-year study of the consistency of alloys in wave soldering processes, including contamination and copper leaching.

New research from Continental Automotive Systems, DfR Solutions and Christopher Associates will highlight the last session on September 22, "Assembly Materials and Component Reliability Testing." This session will provide test data on a number of programs, including a comparison of solder spread results for multiple printed board surface finishes using various lead-free solder pastes; a methodology for predicting the reliability of complex ICs, such as FPGAS, ADCs and memory; and a report of performance results for a new plasma polymer printed board surface finish, including storage robustness, corrosion resistance and solderability.

Supplier Declaration Subcommittee
IPCs 2-18 Supplier Declaration Subcommittee will meet in person during IPC Midwest. To attend these and/or other IPC standards development meetings, individuals must register for IPC Midwest at

In an era of intense scrutiny over "what" materials are used in electronic products and "from where" those materials originate, Krista Crotty, founder of Alberi EcoTech, and Jorgen Vos, product management director at PTC, have accepted the co-leadership roles of IPC's 2-18 Supplier Declaration Subcommittee. Charged with the development and oversight of the 175x family of data exchange standards, such as IPC-1752A, Materials Declaration Management, the subcommittee helps the global electronics industry better manage the growing reporting requirements of the world?s evolving environmental regulations as well as new corporate social responsibility requirements, such as conflict minerals reporting.

Contact: IPC 877-472-4724 or 847-597-2860 Web:

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