Save. Share. Connect.
Thursday, May 25, 2017
VOLUME -26 NUMBER 9
Publication Date: 09/1/2011
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Assembly and Production
Product Preview: AATE and IPC-MW
September 2011 Issue
Add Message Board
SMT Hybrid Packaging 2012
Nuremberg, Germany — The International Exhibition & Conference for System Integration in Microelectronics, SMT/HYBRID/PACKAGING, will take place once again next May 8-10 at the Nuremburg Trade Fair Center, Nuremberg, Germany.
The ideal platform for the micro-electronics industry, this show presents the latest trends and developments, as well as up-to-date solutions. Trade visitors are experts and decision makers concerned with development, production, quality control and technical management, and will be coming from 48 countries. Some of the show's key product categories include PCB production, Design and Development, Components, Packaging, Test Systems, Contract Manufacturing, Screen Printing and Soldering.
The international conference, running parallel to the exhibition, is the most important practical forum on micro-electronics in Europe, and will provide a platform for presenting and discussing new research results, applications and user reports. Conference and tutorials provide support for the industry in its search for innovative solutions.
Contact: Kallman Associates, Inc., 20 Harrison Avenue, Waldwick, NJ 07463-1709
201-652-7070 fax: 201-652-3898 E-mail email@example.com Web:
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | firstname.lastname@example.org
powered by GIM