Monday, October 23, 2017
VOLUME -26 NUMBER 10
Publication Date: 10/1/2011
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Archive >  October 2011 Issue >  Front Page News > 
October '11: Giant Radiation Generators Mark Major Milestones

Albuquerque, NM — Two remarkable pulsed-power machines used to test the nation's defenses against atomic weapons have surpassed milestones at Sandia National Laboratories: 4,000 firings, called "shots," on the Saturn accelerator and 9,000 shots on the HERMES III accelerator.
 Saturn — originally projected to last 5 to 10 years — began operating in 1987. Its major function has been to ...
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Graphene Overtaking Carbon Nanotubes


Cambridge, MA — Carbon Nanotubes (CNTs) have not yet met commercial expectations from a decade ago, and now hot on their heels is graphene. Graphene is considered a hot candidate for applications such as computers, displays, photovoltaics, and flexible electronics. IDTechEx market forecasts indicate ...Read More
North American PCB Industry Forecasts Growth

Bannockburn, IL — While the volume of North American PCB production remains flat, sales of PCBs by North American manufacturers returned to strong growth in 2010. Sales of rigid PCBs were up 18 percent and sales of flexible circuits grew 16 percent in 2010. These are among the trends explored in 2010-2011 ... Read More


 
 
European Space Agency approval for Ventec material in Amphenol Invotec rigid & flex-rigid production

Amphenol Invotec, one of Europe’s leading manufacturers of complex printed circuit boards (PCBs), and Ventec International, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, are delighted to announce that Ventec's VT-901 polyimide material is now fully qualified by ESA in Amphenol Invotec’s manufacturing process for rigid and Flex-rigid PCBs.


New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

DELAWARE, OH Engineered Material Systems, Inc., a leading global supplier of negative photo resist materials for MEMS and TSV passivation/sealing applications, is pleased to introduce the DF-2005 dry-film negative photo resist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (metallization). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.


 
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