Aylesbury, Buckinghamshire, UK — Nordson DAGE, a division of Nordson Corporation is showing its latest bond testing and X-ray inspection systems.
|Flagship XD7600NT X-ray system.
The company is showcasing its next generation 4000Plus bondtester that represents the new industry standard in bond testing with extraordinary data accuracy and repeatability. The same system also provides pad cratering inspection a unique patented technique for attaching a test probe to solder bumps or solder paste in order to perform a hot bump pull test. This is in full accordance with the recently published IPC-9708 test standards for the detection of pad cratering for surface mount and printed circuit board assemblies. Pad cratering has become a major issue with lead-free assemblies and the development of the IPC-9708 standard together with the availability of the 4000Plus hot bump pull test methodology enables product developers to determine the optimum materials for their applications.
The company's flagship X-ray inspection systems, the XD7600NT Diamond FP and XD7600NT Ruby FP use the latest technology, flat panel detector to provide the highest quality real time X-ray imaging. The company's unique NT maintenance-free, sealed transmissive X-ray tube reportedly provides 100 nanometer (0.1µm) feature recognition and up to 10watts of power. Coupled with the 3 megapixel longer lifetime CMOS flat panel detector, these systems provide for the best performance and highest magnification in real-time imaging.
Contact: Nordson DAGE, 48065 Fremont Blvd., Fremont, CA 94538-6541 510-683-3930 Web: http://www.nordsondage.com