Saturday, April 21, 2018
VOLUME -26 NUMBER 12
Publication Date: 12/1/2011
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Archive >  December 2011 Issue >  Front Page News > 
Dec '11: Chipping Away at Antimatter Mysteries

Gaithersburg, MD — While they're not quite ready to build a Warp Drive for interstellar space travel, a team of researchers working at the National Institute of Standards and Technology (NIST) has just concluded a 10-year-long study of the fate of neutrons. They're still trying to discover why there   is "stuff" in the universe — more properly, why there is an imbalance between matter and antimatter — one of the long-standing mysteries of cosmology ...
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Thailand Floods Mean HDD Shortages


The impact of the October/November monsoon floods in Thailand on many high technology industries has been considerable. Perhaps none have been as hard hit as the HDD industry where major plants for Western Digital and Toshiba were flooded and many major HDD component suppliers were flooded as well ...Read More
TE & Juice Team Up to Deliver Smart Charging for Electric Vehicles

Troy, MI — TE Connectivity (TE) and Juice Technologies, doing business as "Plug Smart", have teamed up to provide smart Electric Vehicle (EV) charging solutions enabling customers to meter their EV's electricity consumption and to communicate data via an innovative smart charging cord and socket ...Read More


 
 
SMTA Europe's Harsh Environments Conference Session 7 to Focus on Hi-Temp Mats/Fab
SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.      
EOS WLC550 series offers maximum Cooling Flexibility on Standard Footprint
Last week at the MT-CONNECT in Nuremberg more than 150 companies from the European MedTec Business met for discussing the latest trends and guidelines in MedTec industry. When EOS power presented its medical up to class-2 powersupplies at MT-CONNECT, the EOS team made an exciting observation: While everyone is still talking about the size of the powersupplies, which is still very true for home devices, the real crucial factor for sales support for larger devices at the MT connect was the cooling.   
SEMI and TechSearch International Report Global Semiconductor Packaging Materials Market Reaches $16.7 Billion

MILPITAS, CA SEMI, the industry association representing the global electronics manufacturing supply chain, and TechSearch International today reported that the global semiconductor packaging materials market reached $16.7 billion in 2017. While slower growth of smartphones and personal computers – the industry’s traditional drivers – is reducing material consumption, the slowdown was offset by strong unit growth in the cryptocurrency market in 2017 and early 2018. Flip chip package shipments into the cryptocurrency market, while providing a windfall to many suppliers, are not expected to remain at high levels.  


C&K ANNOUNCES THAT IT HAS ACQUIRED VUILLERMOZ
Newton, MA – C&K, one of the world’s most trusted brands of high-quality electromechanical switches, today announces that it has acquired the company Vuillermoz, a micro-mechanical components and tooling company located in St. Claude, France.



 
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