Sunday, June 25, 2017
VOLUME -26 NUMBER 12
Publication Date: 12/1/2011
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Archive >  December 2011 Issue >  Front Page News > 
Dec '11: Chipping Away at Antimatter Mysteries

Gaithersburg, MD — While they're not quite ready to build a Warp Drive for interstellar space travel, a team of researchers working at the National Institute of Standards and Technology (NIST) has just concluded a 10-year-long study of the fate of neutrons. They're still trying to discover why there   is "stuff" in the universe — more properly, why there is an imbalance between matter and antimatter — one of the long-standing mysteries of cosmology ...
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Thailand Floods Mean HDD Shortages


The impact of the October/November monsoon floods in Thailand on many high technology industries has been considerable. Perhaps none have been as hard hit as the HDD industry where major plants for Western Digital and Toshiba were flooded and many major HDD component suppliers were flooded as well ...Read More
TE & Juice Team Up to Deliver Smart Charging for Electric Vehicles

Troy, MI — TE Connectivity (TE) and Juice Technologies, doing business as "Plug Smart", have teamed up to provide smart Electric Vehicle (EV) charging solutions enabling customers to meter their EV's electricity consumption and to communicate data via an innovative smart charging cord and socket ...Read More


 
 
SV TCL Recognized as a VLSIresearch THE BEST Subsystems Supplier
TEMPE, AZ - SV Probe Pte. Ltd. (“SV TCL”), a leading global supplier of high-performance probe cards and semiconductor test solutions, today announced that VLSIresearch has released a detailed white paper with additional SV TCL results from their 2017 Customer Satisfaction Survey (“CSS”).

Micralyne and Microplex Partner to Deliver Metal "Through Silicon Via" Wafers
EDMONTON, ALBERTA - Micralyne Inc., a leading manufacturer of MicroElectroMechanical Systems (MEMS) and a primary supplier of sensors, is pleased to announce a collaboration with Microplex in Placentia, California to develop and manufacture custom wafers with Metal Through Silicon Via's (TSV). The joint development of this technology leverages the specific expertise of each company to enable a truly flexible and cost effective Metal TSV solution for sensor and semiconductor applications.
 

NFI Corp. (Nameplates For Industry) Announces New Ownership; Hingham resident takes reins of global company
NEW BEDFORD, MA - NFI Corp. (Nameplates For Industry, www.nameplatesforindustry.com), the New Bedford-based global leader in high performing printed graphic solutions, recently announced that the firm has been acquired by Renaud Megard of Hingham, Mass., who now serves as the company’s president and CEO.

SEMI Europe Applauds New Semiconductor Manufacturing Investment
BERLIN, GERMANY - SEMI Europe today commended the announcement of a new electronics manufacturing facility in Dresden, Germany and the supporting public policy to reinvigorate regional innovation. SEMI Europe, the European regional office of the global industry association SEMI, engages SEMI members to advance the global electronics manufacturing supply chain.

 
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