Wednesday, December 7, 2016
VOLUME -26 NUMBER 12
Publication Date: 12/1/2011
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Archive >  December 2011 Issue >  Electronic Mfg. Products > 

Nihon Superior: Solder Paste Selector Guide
Lead-free pastes in selection guide.
Osaka, Japan — Nihon Superior Co. Ltd. has introduced the new Selector Guide for SN100C solder pastes. Located at
http://www.nihonsuperior.co.jp/english/topics/topics.php/504/, the guide includes a detailed list of features for SN100C Solder Pastes. It includes SN100C P500 D4 for excellent reflow with minimum incidents of solder balling and mid-chip balling, SN100C P520 D5 for excellent reflow on very small pads and chip components down to 01005 (0402 metric), and SN100C P800 D2 low voiding paste for high-reliability assembly.

In addition, the completely halogen-free SN100C P602 D4 minimizes formation of corrosion-induced whiskers.

With a linear ramp-to-peak temperature of 240°C, SN100C lead-free solder pastes can be reflowed with a similar linear reflow profile to that commonly used with Sn-3.0Ag-0.5Cu even though the melting point of the SN100C alloy is approximately 8°C higher.

Contact: Nihon Superior Co. Ltd., NS Bldg., 1-16-15 Esaka-Cho, Suita City, Osaka, 564-0063 Japan 81-(0)6-6380-1121 fax: 81-(0)6-6380-1262 Web:
http://www.nihonsuperior.co.jp

 
 
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