Save. Share. Connect.
Tuesday, August 30, 2016
VOLUME - NUMBER
SEMICON West '16
Atlantic Design/ATX/MDM '16
NEPCON China,SMT/Hybrid Pkg,EDS,EWPTE '16
ATX/MDM West '16
productronica,The ASSEMBLY Show, IMAPS, MDM/Minneapolis '15
Nepcon South China '15
SEMICON West '15
ATX/MDM EAST '15
EDS, SMT/Hybrid Pkg,Wire Tech Expo '15
NEPCON China '15
ATX WEST/APEX '15
AATE and IPC MW 11
SMTAI, Autotest, ATX MW/MDM and Assembly '14
SEMICON West '13
Electronics West/MDM and IPC/APEX '13
SEMICON West '14
NEPCON China, SMT/Hybrid Pkg, EDS, NWPTE '14
IPC APEX '14
Electronics West/MDM 10
ATX Midwest, IMAPS, PCB West '13
ATX West '14
ATExpo & IPC MW 07
NEPCON China '13, EDS, more
SEMICON WEST/Intersolar '12
NEPCON China Product Preview '12
Atlantic Design/MDM 10
Electronics West/MDM 11
SEMICON WEST 10
Atlantic Design/MDM 11
ATLANTIC DESIGN & MFG '13
Atlantic Design/MDM 09
SEMICON WEST 08
NEPCON South China '13
ATExpo & IPC MW 08
Electronics West/MDM 08
NEPCON China Product Preview '13
Electronic West/MDM 09
SMTAI and productronica '13
Multi tradeshow Product Preview '12
AATE/IPC Midwest 10
Electronics West/MDM 12
ATE and IPC MW 09
SMTAI and productronica '13
Atlantic Design/MDM 08
HOME / CURRENT ISSUE
Add Message Board
Finetech Adds New Features to Fineplacer
Optical placement system.
Berlin, Germany — Finetech's Fineplacer
lambda has undergone some serious refinements with added new features. Sporting a whole new lighting system, the optical system now allows separate adjustment of chip and substrate illumination. The lighting settings can be adapted to different surface characteristics (reflectivity) of chip and substrate. An integrated oblique illumination gives additional image information on structures and fiducials.
An innovative software-controlled virtual shutter provides alternating illumination of chip and substrate with a manually adjustable frequency. This approach utilizes the human eye's naturally slow visual processing.
While a mechanical shutter would cause a loss of image information, the visual alignment with this system's overlay images now looks and feels natural and uninterrupted. The optimal light values and shutter parameters can be saved together with every working step.
A new option for the alignment camera allows image shifting to expand the visible image of a chip in y-direction. This is useful when chip and substrate have to be aligned under maximum magnification and the chip's fiducials are outside the field of view.
An optimized positioning table and extra-sensitive vacuum detection allow for special applications that may require a Z-shift of the substrate from focal plane to the placement plane after alignment. To maintain accuracy, the company has developed an optimized Z-travel guide for the positioning table. Digital micrometer screws provide 1µm resolution for all axes.
In addition, the tool's vacuum-based chip detection is needed to trigger motorized placement and bonding processes, and this has been improved by optimizing the measuring methodology. Even particularly small, light and delicate chips can now be detected with high reliability.
Contact: Finetech, 8380 S. Kyrene, Ste. 110, Tempe, AZ 85284
480-893-1630 fax: 480-893-1632 E-mail: email@example.com Web:
See at productronica Booth #A4.281.
© 2015 USTECH. All Rights Reserved. |
Contact Us: 610-783-6100 | firstname.lastname@example.org
powered by GIM