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Quik-tool Bottomside Support for Mydata Placer
Publication Date: 2/23/2012

Plainville, MA — Quik-tool LLC, manufacturer of a line of automatic PCB support systems, is introducing the custom fit tooling solution for MYDATA pick-and-place equipment.
Photo Stencil Offering Stencils in VectorGuard Frames
Publication Date: 2/23/2012

Colorado Springs, CO — Photo Stencil, LLC, a full-service provider of high-performance stencils and tooling, now makes available its full range of stencil products and technologies integrated in DEK's VectorGuard® frameless stencil tensioning system. This includes Photo Stencil's new NicAlloy-XT ...
Production Solutions: Board Support Tooling
Publication Date: 2/23/2012

Poway, CA — Production Solutions Inc. is showing its new RED-E-SET SZ GO! — a cost-effective board support tooling solution designed for applications that do not require rigid fixed height support. Utilizing the company's patent pending design, the GO! is a hands- and tool-free support that requires ...
PVA Shows 5 New Coating & Dispensing Solutions
Publication Date: 2/23/2012

Cohoes, NY — PVA (Precision Valve & Automation, Inc.) is showcasing its line of coating and automated dispensing equipment, as well as a variety of new options and accessories. Demonstrating the company's conformal coating capabilities is the PVA650 Selective Coating and Dispensing System with 4 ...
OK Int'l Intros New Advance Package Rework Solution
Publication Date: 2/23/2012

Garden Grove, CA — OK International is unveiling the new Metcal Scorpion Rework System, designed to meet the challenges of array package rework, and the accurate placement of BGAs, in particular. This BGA placement called for a solution that allowed for simultaneous viewing of Printed Circuit Board ...
Nordson DAGE Intros X-Plane to U.S. Market
Publication Date: 2/23/2012

Aylesbury, Buckinghamshire, UK — Nordson DAGE, a division of Nordson Corporation, is introducing X-Plane to the U.S. market for the first time. This new option for the company's range of X-ray inspection systems uses a proprietary, patent applied for, tomosynthesis, or CT technique to create ...
Nihon Superior Intros New Lead-Free Solder
Publication Date: 2/23/2012

Osaka, Japan — Nihon Superior Co. Ltd. is introducing the latest addition to its SN100C lead-free solder series, a flux-core wire solder. The new 551CT formulation combines the benefits of the SN100C high reliability alloy with a sustained activity cored flux. The 551CT core flux is formulated for ...
Mirtec: Full Range of AOI, SPI, X-ray
Publication Date: 2/23/2012

Oxford, CT — Mirtec is rolling out its entire line of 3D AOI, SPI, X-ray and LED inspection systems. First in line is the company's MV-7xi 2D/3D In-Line AOI Machine. According to the company, this technologically advanced system combines the company's exclusive 15MegaPixel 2D ISIS Vision System with ...
Nano Stencil Coating from Microscreen
Publication Date: 2/23/2012

South Bend, IN — MicroScreen is bringing more options to better assist in all stencil needs,. The company now offers a Nano/Fluxophobic coating for laser cut stencils. This two-part material (primer and coating) is applied to the contact side to make the stencil flux-repellent.
Microscan: Machine Vision Products
Publication Date: 2/23/2012

Renton, WA — Microscan's AutoVISION machine vision product suite is relied upon by Electronics manufacturers to provide machine vision that ensures accurate board assembly and achieve "cradle-to-grave" traceability.
ERSA Intros New Stencil Printer
Publication Date: 2/23/2012

Wertheim, Germany — Ersa has launched its latest screen printer: the VERSAPRINT F1. The new machine is designed to fit right into the production line, and will reportedly satisfy the most demanding of product specification requirements.
ESSEMTEC: SMT Production Solutions
Publication Date: 2/23/2012

Aesch, Switzerland — Essemtec is showing an entire production line of equipment — the PANTERA-XV placer, Cobra 8C placer, Paraquda 4C pick-and-place machine, Tuscano USC-V automatic stencil printer, Tower automatic storage system for reels and trays, the RO300FC-C convection oven, and the Fino ...
Europlacer: Hi Performance SMT Pick and Place
Publication Date: 2/23/2012

Tampa, FL — Europlacer is demonstrating its iineo II and XPii-II SMT pick-and-place platforms, with the machines in an in-line-configuration, showing how the two machines work together to offer a highly flexible, 60,000 CPH solution to meet growing customer demand for greater productivity.
Filtration System on a Cart from EVS
Publication Date: 2/23/2012

Newport, UK — EVS International is showing its 7000LFHS solder recovery system in the Sono-Tec booth. The company will preview its latest innovations and upgrades including new operating parameters and software, increased extraction, improved thermal efficiency and dramatically increased recovery ...
Stress-Free Depanelizing from Fancort
Publication Date: 2/23/2012

West Caldwell, NJ — Fancort is introducing a new depaneling machine designed to separate metalized circuit boards from pre-scored panels without stress and excessive wear to the knives. The new machine is a pneumatically operated shear with two wedge shaped knives that shear panels with a gentle ...
FCT Assembly: New Solder and Stencil Technologies
Publication Date: 2/23/2012

Milpitas, CA — FCT Assembly is showcasing its new line of no-clean, halogen-free solder pastes along with its latest stencil technologies. NL930PT is a no-clean, lead-free, halogen-free pin-probable solder paste. The paste is unusual in that it is a clear residue, pin-probable paste that can print ...
Finetech: Core Rework System
Publication Date: 2/23/2012

Tempe, AZ — Finetech is highlighting its Fineplacer® core rework system which offers proven rework technology for a wide spectrum of SMT components, ranging in size from 0201 to 70 x 70mm BGAs, and handling PCBs up to 310 x 400mm. The semi-automated design includes force measurement with automatic ...
FKN Singulator Cuts Circular Tabs
Publication Date: 2/23/2012

Millis, MA — The FKN Systek N200 punch depanelizes odd-shaped boards. The machine is a top-down air operated punch for separating tab routed panels one tab at a time. An upper and lower matching knife blade is used to pinch the tabs apart. This method produces less stress on the PCB than a punch ...
Goepel Intros Mass Interconnect JTAG Interface
Publication Date: 2/23/2012

Jena, Germany — Goepel electronic has introduced PXI 1149/DAK, a mass interconnect interface within the framework of the company's SCANFLEX® JTAG/Boundary Scan hardware platform. The new option for the SFX/PXI1149/Cx controller is compatible with SCOUT, the mass interconnect system from MAC Panel ...
GPD Global: New Hi Res Fluid Dispensing
Publication Date: 2/23/2012

Grand Junction, CO — GPD Global is showcasing its Positive Cavity Displacement (PCD) "H" Series high-resolution fluid dispensing pumps. According to the company, the new pumps provide next-generation volumetric dispensing and are compatible with materials used in electronics assembly such as epoxies ...
 
 
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