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Thursday, March 23, 2017
VOLUME -27 NUMBER 4
Publication Date: 04/1/2012
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Assembly and Packaging
NEPCON China Product Preview
April 2012 Issue
Front Page News
Sandia: Working on the Bionic Man
Albuquerque, NM — Sandia National Laboratories researchers, using off-the-shelf equipment in a chemistry lab, have been working on ways to improve amputees' control over prosthetics with direct help from their own nervous systems.
Multitasking: A Deadly Habit
By Thomas Adams
You are doing 50 mph in the right lane, using your hands-free cell phone to sort out an upcoming business meeting. Ahead of you, a lost driver, partly obscured by a row of trees, is coming down a street that intersects the highway you are on. The driver will run the stop sign and appear broadside ...
Printed Electronics to Reach $9.4 Billion in 2012
By Raghu Das, CEO, IDTechEx
Cambridge, U.K. — The market for printed and potentially printed electronics in 2012 will be $9.4 Billion according to new research by IDTechEx. This figure includes devices not yet printed today but which are moving towards being printed. Of this market, 30 percent of the devices studied are made ...
European SEMI Award Honors Advanced Packaging Technologists
MUNICH, GERMANY - At the SEMI Industry Strategy Symposium in Munich, SEMI announced recipients of the European SEMI Award for 2016:
, deputy director of the Fraunhofer IZM;
, fellow and program director of 3D System Integration at imec; and
SHENMAO America, Inc. Introduces Omega Aleaciones S.A. de C.V. the Exclusive Mexico Distributor of SHENMAO Solder Paste & Flux
JALISCO, MEXICO - Omega Aleaciones S.V. Sales and Application Engineering Team reinforces SHENMAO’s commitment to providing our worldwide EMS and OEM customers with the highest quality and technical solutions Solder Paste to meet the challenges of today’s SMT Assembly and Product Reliability throughout Mexico.
MEMS & Sensors Industry Group Tackles Technical Challenges at Annual Technical Congress: May 10-11 at Stanford University (Stanford, CA)
PITTSBURGH, PA - Microelectromechanical systems (MEMS) and sensors suppliers are targeting a rapidly growing global market for their devices, key components that increase the intelligence and interactivity of billions of electronic products.
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