Friday, April 20, 2018
VOLUME -27 NUMBER 4
Publication Date: 04/1/2012
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Archive >  April 2012 Issue >  Front Page News > 
Sandia: Working on the Bionic Man

Albuquerque, NM — Sandia National Laboratories researchers, using off-the-shelf equipment in a chemistry lab, have been working on ways to improve amputees' control over prosthetics with direct help from their own nervous systems.
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Multitasking: A Deadly Habit


You are doing 50 mph in the right lane, using your hands-free cell phone to sort out an upcoming business meeting. Ahead of you, a lost driver, partly obscured by a row of trees, is coming down a street that intersects the highway you are on. The driver will run the stop sign and appear broadside ...Read More
Printed Electronics to Reach $9.4 Billion in 2012


Cambridge, U.K. — The market for printed and potentially printed electronics in 2012 will be $9.4 Billion according to new research by IDTechEx. This figure includes devices not yet printed today but which are moving towards being printed. Of this market, 30 percent of the devices studied are made ...Read More


 
 
SMTA Europe's Harsh Environments Conference Session 7 to Focus on Hi-Temp Mats/Fab
SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.      
EOS WLC550 series offers maximum Cooling Flexibility on Standard Footprint
Last week at the MT-CONNECT in Nuremberg more than 150 companies from the European MedTec Business met for discussing the latest trends and guidelines in MedTec industry. When EOS power presented its medical up to class-2 powersupplies at MT-CONNECT, the EOS team made an exciting observation: While everyone is still talking about the size of the powersupplies, which is still very true for home devices, the real crucial factor for sales support for larger devices at the MT connect was the cooling.   
SEMI and TechSearch International Report Global Semiconductor Packaging Materials Market Reaches $16.7 Billion

MILPITAS, CA SEMI, the industry association representing the global electronics manufacturing supply chain, and TechSearch International today reported that the global semiconductor packaging materials market reached $16.7 billion in 2017. While slower growth of smartphones and personal computers – the industry’s traditional drivers – is reducing material consumption, the slowdown was offset by strong unit growth in the cryptocurrency market in 2017 and early 2018. Flip chip package shipments into the cryptocurrency market, while providing a windfall to many suppliers, are not expected to remain at high levels.  


C&K ANNOUNCES THAT IT HAS ACQUIRED VUILLERMOZ
Newton, MA – C&K, one of the world’s most trusted brands of high-quality electromechanical switches, today announces that it has acquired the company Vuillermoz, a micro-mechanical components and tooling company located in St. Claude, France.



 
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