Saturday, April 21, 2018
VOLUME -27 NUMBER 5
Publication Date: 05/1/2012
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Archive >  May 2012 Issue >  Front Page News > 
Solar Powered Hydrogen Filling Station


Freiburg, Germany — The Fraunhofer Institute for Solar Energy CF Systems inaugurated a solar hydrogen filling station in Freiburg on March 2. Sponsored by the Ministry of the Environment Baden-Wuerttemberg, the publicly accessible filling station serves not only as a demonstration platform but also represents a milestone in the development of a network of hydrogen filling stations being set up in the State of Baden-Wuerttemberg....
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PC Shipments to Have Strong Second Half

Framingham, MA — Worldwide PC shipment growth for 2011 ended on a slightly positive note, growing to 1.8 percent on the year, according to the International Data Corporation (IDC) Worldwide Quarterly PC Tracker. While the first half of 2012 is expected to see only modest shipment growth, the launch of Windows ...Read More
IPC Technology Roadmap: Vision of Future

Bannockburn, IL — The long-awaited 2011 IPC International Technology Roadmap for Electronic Interconnections was released in February at IPC APEX EXPO® 2012. Published every two years, the IPC Roadmap serves as an authoritative guide to interconnect technological trends, providing a vision of imminent, innovative ...Read More


 
 
SMTA Europe's Harsh Environments Conference Session 7 to Focus on Hi-Temp Mats/Fab
SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.      
EOS WLC550 series offers maximum Cooling Flexibility on Standard Footprint
Last week at the MT-CONNECT in Nuremberg more than 150 companies from the European MedTec Business met for discussing the latest trends and guidelines in MedTec industry. When EOS power presented its medical up to class-2 powersupplies at MT-CONNECT, the EOS team made an exciting observation: While everyone is still talking about the size of the powersupplies, which is still very true for home devices, the real crucial factor for sales support for larger devices at the MT connect was the cooling.   
SEMI and TechSearch International Report Global Semiconductor Packaging Materials Market Reaches $16.7 Billion

MILPITAS, CA SEMI, the industry association representing the global electronics manufacturing supply chain, and TechSearch International today reported that the global semiconductor packaging materials market reached $16.7 billion in 2017. While slower growth of smartphones and personal computers – the industry’s traditional drivers – is reducing material consumption, the slowdown was offset by strong unit growth in the cryptocurrency market in 2017 and early 2018. Flip chip package shipments into the cryptocurrency market, while providing a windfall to many suppliers, are not expected to remain at high levels.  


C&K ANNOUNCES THAT IT HAS ACQUIRED VUILLERMOZ
Newton, MA – C&K, one of the world’s most trusted brands of high-quality electromechanical switches, today announces that it has acquired the company Vuillermoz, a micro-mechanical components and tooling company located in St. Claude, France.



 
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