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Friday, March 24, 2017
VOLUME -27 NUMBER 5
Publication Date: 05/1/2012
Front Page News
People in the News
Electronic Mfg. Services
Electronic Mfg. Products
Special Features: Components and Distribution
Multi Tradeshow Product Preview
May 2012 Issue
Front Page News
Solar Powered Hydrogen Filling Station
By Walter Salm
Freiburg, Germany — The Fraunhofer Institute for Solar Energy CF Systems inaugurated a solar hydrogen filling station in Freiburg on March 2. Sponsored by the Ministry of the Environment Baden-Wuerttemberg, the publicly accessible filling station serves not only as a demonstration platform but also represents a milestone in the development of a network of hydrogen filling stations being set up in the State of Baden-Wuerttemberg....
PC Shipments to Have Strong Second Half
Framingham, MA — Worldwide PC shipment growth for 2011 ended on a slightly positive note, growing to 1.8 percent on the year, according to the International Data Corporation (IDC) Worldwide Quarterly PC Tracker. While the first half of 2012 is expected to see only modest shipment growth, the launch of Windows ...
IPC Technology Roadmap: Vision of Future
Bannockburn, IL — The long-awaited 2011 IPC International Technology Roadmap for Electronic Interconnections was released in February at IPC APEX EXPO
2012. Published every two years, the IPC Roadmap serves as an authoritative guide to interconnect technological trends, providing a vision of imminent, innovative ...
European SEMI Award Honors Advanced Packaging Technologists
MUNICH, GERMANY - At the SEMI Industry Strategy Symposium in Munich, SEMI announced recipients of the European SEMI Award for 2016:
, deputy director of the Fraunhofer IZM;
, fellow and program director of 3D System Integration at imec; and
SHENMAO America, Inc. Introduces Omega Aleaciones S.A. de C.V. the Exclusive Mexico Distributor of SHENMAO Solder Paste & Flux
JALISCO, MEXICO - Omega Aleaciones S.V. Sales and Application Engineering Team reinforces SHENMAO’s commitment to providing our worldwide EMS and OEM customers with the highest quality and technical solutions Solder Paste to meet the challenges of today’s SMT Assembly and Product Reliability throughout Mexico.
MEMS & Sensors Industry Group Tackles Technical Challenges at Annual Technical Congress: May 10-11 at Stanford University (Stanford, CA)
PITTSBURGH, PA - Microelectromechanical systems (MEMS) and sensors suppliers are targeting a rapidly growing global market for their devices, key components that increase the intelligence and interactivity of billions of electronic products.
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